Seminar on Design and fabrication process of rigid flex PCBs

The department of Electrical engineering organized a seminar on design and fabrication process of rigid flex PCBs on 6th November 2024. The seminar was part of the 3-day faculty development program that was conducted by Engr. Ali Nisar who is a senior research officer and project director at National Institute of Electronics. 
The seminar aimed to provide the skills necessary to effectively implement designs requiring flex and rigid flex circuits in accordance with product requirements. The seminar focussed on the impact of these designs on manufacturing and assembly techniques. 
The participants were provided with the opportunity to explore PCB design software and understand how to define board stack ups and outline geometry for complex board shapes.